MPX5700 rev 6, 10/2004 freescale semiconductor technical data ? freescale semiconductor, in c., 2004. all rights reserved. integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated the MPX5700 series piezoresistive tran sducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with a/d inputs. this patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bi polar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. features ? 2.5% maximum error over 0 to 85 c ? ideally suited for mi croprocessor or microcontroller-based systems ? available in absolute, differential and gauge configurations ? patented silicon shear stress strain gauge ? durable epoxy unibody element ordering information device type options case type mpx series order number device marking basic element differential 867 MPX5700d MPX5700d absolute 867 MPX5700a MPX5700a ported elements differential dual ports 867c MPX5700dp MPX5700dp gauge 867b MPX5700gp MPX5700gp gauge, axial 867e MPX5700gs MPX5700d absolute 867b MPX5700ap MPX5700ap absolute, axial 867e MPX5700as MPX5700a absolute, axial pc mount 867f MPX5700asx MPX5700a MPX5700 series integrated pressure sensor 0 to 700 kpa (0 to 101.5 psi) 15 to 700 kpa (2.18 to 101.5 psi) 0.2 to 4.7 v output pin number 1 v out 4 n/c 2 gnd 5 n/c 3 v s 6 n/c note: pins 4, 5, and 6 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. MPX5700d case 867 MPX5700ap case 867b MPX5700as case 867e MPX5700dp case 867c MPX5700asx case 867f figure 1. fully integrated pressure sensor schematic sensing element thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry v s v out gnd pins 4, 5, and 6 are no connects
sensors 2 freescale semiconductor MPX5700 table 1. maximum ratings (1) 1. maximum ratings apply to case 867 only. extended exposure at the specified limits may cause permanent damage or degradation t o the device. parametrics symbol value unit maximum pressure (2) (p2 1 atmosphere) 2. this sensor is designed for applicat ions where p1 is always greater than, or equal to p2. p2 maximum is 500 kpa. p1 max 2800 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c table 2. operating characteristics ( v s = 5.0 vdc, t a = 25c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 4 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range (1) gauge, differential: MPX5700d absolute: MPX5700a p op 0 15 ? ? 700 700 kpa supply voltage (2) v s 4.75 5.0 5.25 vdc supply current i o ?7.010madc zero pressure offset (3) gauge, differential (0 to 85 c) absolute (0 to 85 c) v off 0.088 0.184 0.2 ? 0.313 0.409 vdc full scale output (4) (0 to 85 c) v fso 4.587 4.7 4.813 vdc full scale span (5) (0 to 85 c) v fss ?4.5?vdc accuracy (6) (0 to 85 c) ? ? ? 2.5 %v fss sensitivity v/p ? 6.4 ?- mv/kpa response time (7) t r ?1.0?-ms output source current at full scale output i o+ ?0.1?-madc warm-up time (8) ??20?-ms 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 5. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature with in the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature poi nts, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25c. ? tcspan: output deviation over the temperature range of 0 to 85c, relative to 25c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85c, relative to 25c. ? variation from nominal: the variation from nominal val ues, for offset or full scale span, as a percent of v fss , at 25c. 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 8. warm-up time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. table 3. mechanical characteristics characteristics typ unit weight, basic element (case 867) 4.0 grams
sensors freescale semiconductor 3 MPX5700 on-chip temperature compensation, ca libration and sig nal conditioning figure 3 illustrates both the differential/gauge and the absolute sensing chip in the basic chip carrier (case 867). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. (for use of the MPX5700d in a high-pressure cyc lic application, consult the factory.) the MPX5700 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 2 shows the sensor output signal relative to pressure input. typical, mi nimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 c using the decoupling circuit shown in figure 4 . the output will saturate outside of the specified pressure range. figure 4 shows the recommended decoupling circuit for interfacing the output of the int egrated sensor to the a/d input of a microprocessor or microc ontroller. proper decoupling of the power supply is recommended. figure 2. output versus pressure differential figure 3. cross-sectional diagrams (not to scale) figure 4. recommended power supply decoupling and output filtering (for additional output filtering, please refer to application note an1646) differential pressure (kpa) output (v) typical minimum 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 100 200 300 400 600 500 maximum 700 800 transfer function: v out = v s *(0.0012858*p+0.04) error v s = 5.0 vdc temperature = 0 to 85c fluoro silicone die coat wire bond die p1 stainless steel metal cover lead frame rtv die bond epoxy case p2 fluoro silicone die coat wire bond die p1 stainless steel metal cover lead frame rtv die bond epoxy case p2 absolute element differential/gauge element +5 v 1.0 f 0.01 f 470 pf gnd v s v out ips output
sensors 4 freescale semiconductor MPX5700 pressure (p1)/vacuum (p2) side identification table freescale designates the two si des of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing fluoro silicone gel which protects the die from ha rsh media. the freescale mpx pressure sensor is design ed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: part number case type pressure (p1) side identifier MPX5700d, MPX5700a 867 stainless steel cap MPX5700dp 867c side with part marking MPX5700gp, MPX5700ap 867b side with port attached MPX5700gs, MPX5700as 867e side with port attached MPX5700asx 867f side with port attached
sensors freescale semiconductor 5 MPX5700 package dimensions case 867-08 issue n basic element pin 1 f g n l r 123456 6 pl d seating plane -t- m a m 0.136 (0.005) t positive pressure (p1) c b m j s -a- style 1: pin 1. vout 2. ground 3. vcc 4. v1 5. v2 6. vex style 3: pin 1. open 2. ground 3. +vout 4. +vsupply 5. -vout 6. open style 2: pin 1. open 2. ground 3. -vout 4. vsupply 5. +vout 6. open max millimeters inches 16.00 13.56 5.59 0.84 1.63 0.100 bsc 2.54 bsc 0.40 18.42 30? nom 30? nom 12.57 11.43 dim a b c d f g j l m n r s min 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 max 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 min 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 notes: 1. 2. 3. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). seating plane r n c j pin 1 m q m 0.25 t b 6x d g f s k v s p m 0.173 q s t l u a 1 2 34 5 6 t p p q q style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex millimeters 2.54 bsc 23.11 bsc dim a b c d f g j k l n p q r s u v min 29.08 17.4 7.75 0.68 1.22 0.36 17.65 7.37 10.67 3.89 3.89 5.84 5.59 4.62 max 29.85 18.16 8.26 0.84 1.63 0.41 18.42 7.62 11.18 4.04 4.04 6.35 6.1 4.93 notes: 1. 2. dimensions are in millimeters. dimensioning and tolerancing per asme y14.5m, 1994. case 867b-04 issue f pressure side ported (ap, gp)
sensors 6 freescale semiconductor MPX5700 package dimensions case 867c-05 issue f pressure and vacuum sides ported (dp) case 867e-03 issue d pressure side ported (as, gs) notes: 1. 2. dimensioning and tolerancing per asme y14.5m, 1994. controlling dimension: inch. r x 123456 port #2 vacuum (p2) port #1 positive pressure (p1) port #1 positive pressure (p1) pin 1 port #2 vacuum (p2) seating plane seating plane -t- -t- p g c j n b f d 6 pl w v l u s k -q- -a- m q m 0.25 (0.010) t m a m 0.13 (0.005) style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.027 0.033 0.68 0.84 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.182 0.194 4.62 4.93 w 0.310 0.330 7.87 8.38 x 0.248 0.278 6.30 7.06 0.220 0.240 5.59 6.10 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. inches 0.100 bsc millimeters 2.54 bsc dim a b c d e f g j k n s v min 0.690 0.245 0.780 0.027 0.178 0.048 0.014 0.345 0.300 0.220 0.182 max 0.255 0.820 0.033 0.186 0.064 0.016 0.375 0.310 0.240 0.720 0.194 min 17.53 6.22 19.81 0.69 4.52 1.22 0.36 8.76 7.62 5.59 4.62 max 18.28 6.48 20.82 0.84 4.72 1.63 0.41 9.53 7.87 6.10 4.93 style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex a 654321 c k n e -b- port #1 positive pressure (p1) j -t- s g f d 6 pl pin 1 m b m 0.13 (0.005) t v
sensors freescale semiconductor 7 MPX5700 package dimensions case 867f-03 issue d pressure side axial port (asx) c e v j port #1 positive pressure (p1) -t- -p- m q m 0.25 (0.010) t d 6 pl f g k pin 1 u a b r s n -q- s p m 0.13 (0.005) q s t 654321 style 1: pin 1. v out 2. ground 3. v cc 4. v1 5. v2 6. v ex millimeters inches 0.100 bsc 2.54 bsc dim a b c d e f g j k n p q r s u v min 1.080 0.740 0.630 0.027 0.160 0.048 0.014 0.070 0.150 0.150 0.440 0.695 0.840 0.182 0.220 max 1.120 0.760 0.650 0.033 0.180 0.064 0.016 0.080 0.160 0.160 0.460 0.725 0.860 0.194 0.240 min 27.43 18.80 16.00 0.68 4.06 1.22 0.36 1.78 3.81 3.81 11.18 17.65 21.34 4.62 5.59 max 28.45 19.30 16.51 0.84 4.57 1.63 0.41 2.03 4.06 4.06 11.68 18.42 21.84 4.93 6.10 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch.
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